The addition of the Ziptronix team will not change Tessera’s target operating expense structure. This is a great alignment of companies that can address rapidly expanding 2.5D and 3D-IC markets.” Joining the Tessera family of companies combines our efforts with a proven leader in technology development and licensing in the semiconductor industry. Ziptronix is headquartered in Raleigh, North Carolina.ĭan Donabedian, President and CEO of Ziptronix added, “We’ve taken our technology from concept to commercialization in the backside illuminated image sensor and RF markets. “There is a great opportunity to further develop these platforms with our technology partners, and we’re very excited about their market potential.”įounded in 2000 as a venture-backed spinoff of RTI International, privately held Ziptronix is a pioneer in the development of low-temperature direct bonding technology for 3D integration. “ZiBond and DBI bonding are enabling technologies that provide significant cost and performance benefits,” said Craig Mitchell, President of Invensas, a Tessera subsidiary. I’m confident that aligning our respective capabilities with our development expertise will help create a multi-hundred million dollar revenue opportunity for Tessera over the next decade as the industry continues to shift toward 3D-IC architectures.” Ziptronix has commercially licensed the ZiBond and DBI technologies and they stack up very well alongside our extensive portfolio of 2.5D and 3D intellectual property. “With the escalating cost for each node of semiconductor lithography, it remains very clear to us that our R&D spend on semiconductor packaging will only become more important and valuable to our customers. “With this acquisition we’re gaining best-in-class technology, along with exceptional people, know-how in the 3D IC market and a significant patent portfolio,” stated Tom Lacey, CEO of Tessera. Inclusive of CMOS image sensors, Tessera expects the annual market size to which this technology applies to exceed $15 billion by 2019.
Ziptronix’s technology is also relevant to next-generation stacked memory, 2.5D FPGAs, RF Front-End and MEMS devices, among other semiconductor applications. Ziptronix’s intellectual property has been licensed to Sony Corporation for volume production of CMOS image sensors – an estimated $8.3 billion market according to Gartner. Ziptronix’s patented ZiBond® direct bonding and DBI® hybrid bonding technologies deliver scalable, low total cost-of-ownership manufacturing solutions for 3D stacking. The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D IC solutions to semiconductor industry customers. announced the acquisition of Ziptronix, Inc. SAN JOSE, CA (August 28) - Tessera Technologies, Inc.
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